| Parameter | Specification |
|---|---|
| Channel Spacing | 200 GHz |
| Central Wavelength (λc) | ITU Grid (channel 23~37 & 45~59) |
| Channel Pass Band | ≥ λc ± 0.25 nm |
| Insertion Loss (Pass Band) | ≤ 3.4 dB |
| Pass Band Ripple | ≤ 0.5 dB |
| Adjacent Channel Isolation | ≥ 30 dB |
| Non-Adjacent Channel Isolation | ≥ 40 dB |
| Directivity | ≥ 50 dB |
| Return Loss | ≥ 45 dB |
| PDL | ≤ 0.2 dB |
| PMD | ≤ 0.1 ps |
| Maximum Power | 300 mW |
| Operating Temperature | 0°C ~ +65°C |
| Storage Temperature | -40°C ~ +85°C |
| Package Dimensions | 100 mm x 90 mm x 12 mm |
| MD Type Packaging | 100 mm x 90 mm x 22 mm |
Note1: All values specified are without connectors.
Note2: Higher performance specifications are available upon request.
Note3: Fiber type Corning SMF-28e.
Note4: Channel count is from low to high for mux and high to low for demux if mux & demux are packaged in one cassette.
Note5: Over operating temperature All SOP
